【Live Streaming/ZOOM】"Basic Information on Semiconductor (IC) Manufacturing Process and Semiconductor Raw Materials ~ Introduction: Semiconductor Manufacturing and Raw Materials - From Front-End to Back-End to Packaging ~" Seminar to be Held! June 11 (Thu), Hosted by CMC Research Co., Ltd.

📢 Hosted by CMC Research Co., Ltd. (https://cmcre.com/), We are pleased to announce an upcoming live streaming seminar! 🎓 Lecturer: Mr. Shigeru Koshibe (Representative Director, I-Pack Co., Ltd.) 📆 Date & Time: Thursday, June 11, 2026, 13:00-16:30 🖥️ Zoom Live Stream (with materials) 💬 Theme: "Basic Information on Semiconductor (IC) Manufacturing Process and Semiconductor Raw Materials ~ Introduction: Semiconductor Manufacturing and Raw Materials - From Front-End to Back-End to Packaging ~" ――This practical seminar provides a comprehensive understanding of the semiconductor manufacturing flow and the relationship with raw materials. Learn across devices, materials, and packaging to grasp Japan's strengths and technological structure. 📌Participation Fee: ・General: 44,000 JPY (tax included) ・Newsletter members: 39,600 JPY (tax included) ・Academic: 26,400 JPY (tax included) 🔗 Details and Registration here 🧠 There will also be a Q&A session. Please join us to utilize this knowledge in your research and work!

【Knowledge to be Gained from the Seminar】 ・Acquire basic knowledge about semiconductor manufacturing ・Obtain information on Japanese technology active in the semiconductor field ・Gain insights into the potential for deploying your company's technology in the semiconductor field

【Target Audience】 ・Those interested in basic technical information on semiconductor (IC) manufacturing ・Those interested in raw materials used in IC manufacturing ・Those interested in Japanese technology (equipment, raw materials) active in IC manufacturing

1) Seminar Theme and Date & Time Theme: Basic Information on Semiconductor (IC) Manufacturing Process and Semiconductor Raw Materials ~ Introduction: Semiconductor Manufacturing and Raw Materials - From Front-End to Back-End to Packaging ~ Date & Time: Thursday, June 11, 2026, 13:00-16:30 Participation Fee: 44,000 JPY (tax included) *with materials *Newsletter registrants: 39,600 JPY (tax included) *Academic price: 26,400 JPY (tax included) Lecturer: Mr. Shigeru Koshibe, Representative Director, I-Pack Co., Ltd.

〈Seminar Purpose〉 Japan plays an active role in the semiconductor field, including manufacturing equipment and raw materials. This seminar will provide an easy-to-understand overview of this entire landscape. As the information society continues to develop, the necessity of semiconductors will further increase. For this reason, semiconductors are expected to continue evolving, and their market will expand. This seminar will explain the flow from the manufacturing process of representative semiconductors = integrated circuits (ICs) to the mounting process on circuit boards, and the roles and necessities of the raw materials used in these processes. Acquiring this basic information on semiconductor manufacturing will be beneficial for future development of semiconductor raw materials.

*This seminar will be a live streaming seminar using the video conferencing tool "Zoom" on the day. Please refer to the tool for recommended environments. A viewing URL will be sent separately via email at a later date. ★Recording or photography during the seminar is strictly prohibited.

2) How to Apply Please apply from the CMC Research seminar website. We will send the viewing URL separately via email in return. Please see the URL for details. 🔗 Register here

3) Introduction to the Seminar Program (Includes a break) 1. Overview of Semiconductor Manufacturing Process (Overall Flow) 2. Front-End Process and Related Raw Materials

(1) Flow of Front-End Process (2) Wafer Manufacturing 1) Raw Materials 2) Manufacturing Method 3) Processing Equipment 4) Process Materials (3) Wafer Processing (Unit Formation and Circuit Processing) 1) Unit Formation 2) Circuit Processing 3) Processing Equipment 4) Process Materials 3. Back-End Process and Related Raw Materials

(1) Flow of Back-End Process (2) Assembly Technology; 1) Mounting 2) Wiring 3) Encapsulation (3) Encapsulation Technology; 1) Encapsulation Methods 2) Encapsulation Materials (4) Back-End; 1) Processing Equipment 2) Process Materials 4. Packaging Process and Related Raw Materials

(1) Flow of Packaging Process (2) Circuit Boards; 1) Types 2) Manufacturing Method (3) Board Mounting; 1) Equipment 2) Process Materials 【Q&A Session】

4) Lecturer Introduction Mr. Shigeru Koshibe, Representative Director, I-Pack Co., Ltd. 【Lecturer's Career】 1974: Graduated from Faculty of Engineering, Osaka University 1976: Completed Master's program, Graduate School of Engineering, Osaka University 1976: Joined Sumitomo Bakelite, engaged in development of semiconductor encapsulating materials, etc. 1988: Joined Tonen Chemical, engaged in development of silica, silicone gels, etc. 2001: Established I-Pack Co., Ltd., responsible for technical consulting in semiconductor and optical component development. 【Activities】 Industrial property applications > 200, Book writing > 60, Seminars > 200 【Activities/Book Writing】 Books related to semiconductor encapsulation 1) Nikkei Microdevices 1984.5.11, P82-92 ・Progress in stress reduction