Kannetsu to Exhibit at Interop Tokyo 2026 (Daiichi Jitsugyo Booth), Solving AI Data Center Heat Challenges with Proven Technology

Interop Tokyo 2026

Kannetsu Co., Ltd. (Headquarters: Kita-ku, Osaka; President and Representative Director: Tsutomu Araki) will participate in Interop Tokyo 2026, held at Makuhari Messe from Wednesday, June 10 to Friday, June 12, 2026, as a supporting manufacturer for Daiichi Jitsugyo Co., Ltd. (Headquarters: Chiyoda-ku, Tokyo; President and CEO: Yuji Funato). At this exhibition, Kannetsu will introduce the "Dry Cooler" and "Mechanical Room" as components of next-generation cooling systems that achieve low PUE, as well as a pre-verification solution using a "Load Bank" (simulated load testing device) to prevent risks before actual operation. Visitors will be able to see the full scope of Kannetsu's advanced thermal engineering, which provides a one-stop service from design and piping to demonstration.

■ The "Three Walls" Facing AI Data Centers

As the social implementation of generative AI rapidly advances, the construction and operation of AI data centers are facing new challenges. The representative issues are a "triple threat" of power shortages, cooling capacity limits, and prolonged construction periods.

The Power Wall
As of 2026, with the rapid advancement of generative AI, ultra-high-density servers exceeding 200kW per rack are becoming a reality. This has led to an explosive increase in the total power consumption of data centers, making securing power supply and efficient energy management urgent priorities.

The Cooling Wall
Liquid cooling is unavoidable to handle high heat density, but there are few domestic companies capable of handling the total design, construction, and verification of next-generation cooling equipment, creating a bottleneck for implementation speed.

The Construction Period Wall
Data center demand is investment-driven, and construction speed determines competitive advantage. However, in recent years, increasingly sophisticated specifications and quality requirements for liquid cooling infrastructure, along with the significant time required for procuring materials that meet strict standards and complex equipment design and adjustment work according to local conditions, are factors that extend the overall construction period.

In response to these challenges, Kannetsu goes beyond being a mere equipment manufacturer, presenting reliable solutions as a "comprehensive engineering company capable of consistently handling everything from design and piping to pre-verification in-house."

■ Exhibition Content

Within the Daiichi Jitsugyo booth, themed "Low PUE Cooling Technology," Kannetsu will introduce core equipment supporting next-generation cooling infrastructure and verification solutions that ensure operational reliability.

[Next-Generation Cooling System Components]

① Dry Cooler

A heat dissipation device that significantly reduces power consumption required for cooling by utilizing free cooling with outside air. While primarily operating in dry mode, it combines an evaporative cooling system during periods of high outside temperature, such as summer, to maintain high cooling capacity even in harsh environments while minimizing WUE (Water Usage Effectiveness). It is suitable for temperature control of the primary cooling water for CDUs (Coolant Distribution Units) and is a core facility contributing to the achievement of "low PUE (around 1.1 level)," a key indicator for next-generation data centers. Furthermore, the combination of high-efficiency EC fans and advanced automatic control enables real-time response to changes in outside temperature and overall facility heat load, allowing for extremely precise temperature management.

② Mechanical Room (Container-Type Cooling Infrastructure Unit)

An all-in-one cooling infrastructure unit that consolidates cooling peripheral equipment such as dry coolers, chillers, pumps, tanks, and control panels within a container. By packaging the cooling infrastructure (container-type solution), it minimizes large-scale on-site piping work, dramatically shortening the data center startup period. It is a ready-to-use infrastructure that can flexibly accommodate future expansion or relocation.

[Verification Solution to Prevent Risks Before Actual Operation]

③ Load Bank (Simulated Load Testing Device)

A testing device that generates electrical and thermal loads simulating actual server operation to test whether the constructed cooling system operates as intended before full-scale operation. Kannetsu has extensive experience in the design, manufacture, and delivery of load banks capable of handling large-capacity, high-load tests exceeding 1MW, consistently supporting pre-implementation system-wide verification (commissioning). By conducting verification before actual operation, it helps prevent fatal risks such as "cooling not keeping up after installation" or "unexpected troubles delaying full-scale operation," contributing to the safe launch of data centers.

■ Why Kannetsu is Chosen: Comprehensive Engineering Beyond Equipment Manufacturing

Kannetsu's greatest strength lies in its ability to provide a seamless, end-to-end service that goes beyond the "manufacturing and sales" of cooling equipment, encompassing heat source selection, piping design, construction management, trial operation, and pre-verification using load banks. This approach helps avoid project delays caused by the involvement of multiple vendors and supports the reliable launch of AI data centers.

Integrated Support Including Piping
Kannetsu handles all construction forms, from container types to large-scale building types (hyperscaler specifications), covering not only primary infrastructure but also the construction of secondary (server-side) equipment, which demands stringent standards. It provides consistent support from efficient layout design to strict cleanliness, ensuring the stable operation of highly challenging next-generation liquid cooling infrastructure.

Shortened Construction Periods with Container-Type Solutions
To address the challenge of data center construction speed, Kannetsu contributes to shortening construction periods with container-type solutions that pre-integrate cooling peripheral equipment. By minimizing large-scale on-site piping work, it reduces the risk of project delays.

Compliance with Environmental Standards (Low PUE, Low WUE)
By combining optimal selection and placement of heat sources with advanced automatic control technology that responds to outside temperature and load fluctuations, Kannetsu achieves both maximum energy efficiency and reduced water usage. It reliably meets the extremely stringent environmental standards required by next-generation data centers, namely "achieving low PUE" and "minimizing WUE."

Contribution to Stable Operation through Pre-Verification
Leveraging its extensive track record in manufacturing and delivering load banks capable of large-capacity, high-load tests exceeding 1MW, Kannetsu supports advanced pre-verification (commissioning) simulating real operational scenarios. By implementing countermeasures before full-scale operation, it helps prevent unexpected troubles and strongly supports stable operation.

■ Exhibition Information

Exhibition Name: Interop Tokyo 2026

Dates: Wednesday, June 10 – Friday, June 12, 2026, 10:00-18:00 (until 17:00 on the final day)

Venue: Makuhari Messe (Mihama-ku, Chiba City), Exhibition Hall 8

Booth Number: Inside Daiichi Jitsugyo Co., Ltd. Booth (Booth No. 8B25)

Official Website: https://www.interop.jp/2026/

Inquiries: https://www.kannetsu.co.jp/solution/datacenter/

■ About Kannetsu Co., Ltd.

Founded in 1978. A comprehensive engineering company that provides energy-saving cooling solutions to various fields, including industrial machinery, data centers, and food processing, with thermal control technology at its core. Chillers, dry coolers, mechanical